FR-4 (Glass Epoxy Laminate)
Flame retardant woven fiberglass cloth with epoxy resin binder — the worldwide standard substrate material for printed circuit boards (PCBs). Designated NEMA grade FR-4 and IPC-4101. Good mechanical strength, dimensional stability and electrical insulation up to 130°C (Tg). Dielectric constant 4.2–4.7 at 1 MHz. Self-extinguishing (UL94 V-0). Used for single/multilayer PCBs, electrical insulation boards, structural composites in electronics, test fixtures and jigs. Available in thicknesses 0.1–50 mm.
Mechanical properties
Related materials
PA66 (Nylon 66)
Polyamide 66 — stiffer and more heat-resistant than PA6. Higher crystallinity gives better creep resistance and ~40°C higher melting point (260°C vs 220°C). Slightly more brittle. More moisture-sensitive at saturation than PA6. Trade names include Ultramid A (BASF), Zytel 101 (DuPont), Tecamid 66 (Ensinger). Dominant in US/UK markets. Used for automotive engine components, electrical connectors, gears, cable ties, and industrial bushings.
PC/ABS (Blend)
Polycarbonate + ABS blend — one of the most widely used industrial thermoplastic alloys. Combines PC impact strength and heat resistance with ABS processability and lower cost. Better chemical resistance than pure PC. Properties tunable by PC/ABS ratio. Trade names include Bayblend (Covestro), Cycoloy (SABIC), Pulse (Techpolymers). Used for automotive dashboards, laptop/phone housings, power tool casings, and 3D printing (FDM filament).
PE-UHMW
Ultra-High Molecular Weight Polyethylene — the highest impact-strength thermoplastic. Molecular weight 2-6 million g/mol. Self-lubricating, extremely wear-resistant (15x better than carbon steel), and chemically inert. Used for hip/knee implant bearings, conveyor guides, dock fenders, chute liners, food processing equipment, and ballistic armor (Dyneema/Spectra fiber form).
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